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Crystallization properties of Sb-rich GeSbTe alloys by in-situ morphological and electrical analysis
Affiliation:1. CNR – IMM, VIII Strada, 5, Catania, 95121 Italy;2. Micron Semiconductor Italia s.r.l., R&D, via C. Olivetti, 2, Agrate Brianza, 20864 Italy;1. Dipartimento di Fisica ed Astronomia-Università di Catania, via S. Sofia 64, 95123 Catania, Italy;2. Consiglio Nazionale delle Ricerche, Istituto per la Microelettronica e Microsistemi (CNR-IMM MATIS) IMM-CNR, via S. Sofia 64, 95123 Catania, Italy;3. Consiglio Nazionale delle Ricerche, Istituto per la Microelettronica e Microsistemi (CNR-IMM), VIII Strada 5, 95121 Catania, Italy;1. Institute of Laser Engineering, Beijing University of Technology, Beijing 100124, China;2. Beijing Engineering Research Center of Applied Laser Technology, Beijing University of Technology, Beijing 100124, China;3. Electrical and Computer Engineering Department, Northeastern University, MA 02115, USA;1. CNR-IMM Catania Headquarters, VIII Strada, 5, 95121 EU, Italy;2. CNR-IMM Bologna, via Gobetti 101, 40129 Bologna, Italy;3. Anton Parr TriTec SA Rue de la Gare 4 Galileo Center, 2034, Peseux, Switzerland;4. Physikalisches Institut (IA), RWTH Aachen University, Sommerfeldstraße 14, 52074 Aachen, Germany;5. Department of Chemical Sciences, University of Catania, Viale A. Doria 6, 95125 Catania, Italy;6. SSC, Scuola Superiore di Catania, Via Valdisavoia 9, 95125 Catania, Italy;7. Electric, Electronics and Computer Engineering Department, University of Catania, Viale A. Doria 6, 95125 Catania, Italy;8. ARCES University of Bologna, Via Toffano 2/2, 40125 Bologna, Italy;1. Institute of Inorganic Chemistry, Kiel University, Max-Eyth-Strasse 2, 24118, Kiel, Germany;2. Institute for Materials Science, Kiel University, Kaiserstrasse 2, 24143, Kiel, Germany;3. Department of Chemistry and Material Science Institute, University of Oregon, Eugene, OR, 97403, United States;4. Institute of Physics, RWTH Aachen University, Sommerfeldstrasse 14, 52056, Aachen, Germany
Abstract:Phase Change Memory (PCM) operation relies on the reversible transition between two stable states (amorphous and crystalline) of a chalcogenide material, mainly of composition Ge2Sb2Te5 (GST). In Wall type PCM cells, cycling endurance induces a gradual change of the cell electrical parameters caused by variations in the chemical composition of the active volume. The region closer to the GST-heater contact area, becomes more Sb rich and Ge depleted. The new alloy has usually different thermal characteristics for the phase transitions that influence the electrical behavior of the cell. In this study we analyze the morphological, structural and electrical properties of two Sb-rich non-stoichiometric alloys: Ge14Sb35Te51 and Ge14Sb49Te37, at their amorphous and crystalline phase. Experiments have been performed in non-patterned blanket films and, to simulate the device size, in amorphous regions of 20 nm, 50 nm and 100 nm diameter respectively. The amorphous Ge14Sb35Te51 film crystallizes in the meta-stable face centered cubic structure at 150 °C and in the rhombohedral phase at 175 °C, behavior characteristic of the Ge1Sb2Te4 composition. The average grain size is of about 100 nm after an annealing at 400 °C. The Ge14Sb49Te37 film crystallizes only in the hexagonal phase, with an average grain size of about 60 nm after annealing at 400 °C. The X-ray fluorescence analysis shows a non uniform distribution of the constituent atoms and in particular a Ge signal decrement and a Sb enrichment at grain boundaries. The in situ annealing of amorphous nano-areas (RESET state under a thermal stress) indicates a fast re-crystallization speed for Ge14Sb35Te51, 80 pm/s at 90 °C, and a lower speed for Ge14Sb49Te37, at 130 °C a grain growth velocity of 50 pm/s has been measured. The different behavior of the two alloys is discussed in terms of structural vacancies filling by the Sb atoms in excess and by their segregation at grain boundaries. The influence of the obtained results on the device characteristics is discussed.
Keywords:Phase Change Memory  Crystallization kinetic  Nanodot  TEM  XRD
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