| 微电子封装无铅焊点的可靠性研究进展及评述 |
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| 引用本文： | 方园,符永高,王玲,王鹏程,周洁.微电子封装无铅焊点的可靠性研究进展及评述[J].电子工艺技术,2010,31(2):72-76. |
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| 作者姓名： | 方园 符永高 王玲 王鹏程 周洁 |
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| 作者单位： | 广州电器科学研究院广东省日用电器公共实验室,广东,广州,510300 |
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| 摘 要： | 在电子电器产品的无铅化进程中,由于封装材料与封装工艺的改变,焊点的可靠性已成为日益突出的问题。着重从无铅焊点可靠性的影响因素、典型的可靠性问题及无铅焊点可靠性的评价3个方面阐述了近年来该领域的研究状况,进而指出无铅化与可靠性研究需注意的问题和方向。
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| 关 键 词： | 电子封装 无铅 焊点可靠性 |
Progress and Review on Lead-free Solder Joint Reliability in Micro-electronic Packaging |
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| FANG Yuan,FU Yong-gao,WANG Ling,WANG Peng-cheng,ZHOU Jie.Progress and Review on Lead-free Solder Joint Reliability in Micro-electronic Packaging[J].Electronics Process Technology,2010,31(2):72-76. |
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| Authors: | FANG Yuan FU Yong-gao WANG Ling WANG Peng-cheng ZHOU Jie |
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| Affiliation: | Guangdong Province Open Lab for Household Electrical Appliances;Guangzhou Electric Apparatus Research Institute;Guangzhou 510300;China |
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| Abstract: | In the lead-free process of electrical and electronic equipment,solder joint reliability has become the increasingly outstanding problem because of the change of material and technology in electronic packaging.Three aspects,influencing factors on lead-free solder joint reliability,typical reliability problems and lead-free solder joint reliability evaluation are elaborated emphatically in detail,in order to demonstrate issues and tendency on lead-free and research on solder joint reliability. |
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| Keywords: | Electronic packaging Lead-free Solder joint reliability |
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