Half-transient liquid phase diffusion welding: An approach for diffusion welding of SiCp/A356 with Cu interlayer |
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Authors: | Meng Hua Wei Guo Hang Wai Law John Kin Lim Ho |
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Affiliation: | (1) Department of Manufacturing Engineering and Engineering Management, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon Tong, Kowloon, Hong Kong, People’s Republic of China |
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Abstract: | Aluminum matrix composite SiCp/A356 was welded by half-transient liquid Phase diffusion welding (HTLPDW) with a Cu interlayer. The effects of welding parameters
and interlayer thickness on the properties of the welded joint were investigated, and the optimal welding parameters were
subsequently put forward. The relationship between the tensile strength of the joint and the microstructure was studied by
analyzing the microstructure of joint using a scanning electron microscope (SEM) and an electron probe micro-analysis (EPMA).
Results confirmed the success of welding aluminum matrix composite SiCp/A356 utilizing HTLPDW method with a Cu interlayer. Shorter welding time was a prominent characteristic of HTLPDW as compared
with conventional transient liquid phase (TLP) diffusion welding. Furthermore, its welded joints had a tensile strength almost
72% of its parent matrix composites, evidently signifying the suitable application of half-transient liquid phase diffusion
welding in welding composite engineering structures. |
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Keywords: | Aluminum matrix composite Half-transient liquid phase diffusion welding SiCp/A356 Cu interlayer |
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