Microhardness and other properties of hydrogenated amorphous silicon carbide thin films formed by plasma-enhanced chemical vapor deposition |
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Authors: | M.A. Bayne Z. Kurokawa N.U. Okorie B.D. Roe L. Johnson R.W. Moss |
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Affiliation: | Hewlett-Packard Inc., Vancouver Division, P.O. Box C-006, Vancouver, WA 98668-C006, U.S.A.;Battelle-Pacific Northwest Laboratories, P.O. Box 999, Richland, WA 99352, U.S.A. |
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Abstract: | ![]() The objective of this work was to correlate thin film microhardness with composition and other properties of the Si-C system. Compositions varying from 80% Si to 100% C were formed using plasma-enhanced chemical vapor deposition on Si〈100〉 substrates. As the fraction of carbon increases from 23 to 100 at.%, the hardness increases from about 2300 to more than 7000 kgf mm-2 (Knoop hardness) at 10% penetration of the indenter. The hardness for stoichiometric SiC is also about 7000 kgf mm-2. At a particular composition the hardness can be maximized by adjusting the deposition parameters to decrease the hydrogen content and to increase the silicon-to-carbon bonding. |
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