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Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi//Cu lead-free solder joints |
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| Authors: | Guo-qiang Wei Lei Wang Xin-qiang Peng Ming-yang Xue |
| Affiliation: | School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640, China |
| Abstract: | soldering alloys soldered joints aging intermetallics activation energy shear strength |
| Keywords: | soldering alloys soldered joints aging intermetallics activation energy shear strength |
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