TiN/TiC multilayer films deposited by pulse biased arc ion plating |
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Authors: | Yanhui Zhao Jinquan Xiao Lishi Wen |
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Affiliation: | a Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, PR China b State Key Laboratory for Materials Modification by Laser, Ion and Electron Beams, Dalian University of Technology, Dalian 116024, PR China |
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Abstract: | TiN/TiC multilayer films were deposited on high-speed-steel (HSS) substrates using pulse biased arc ion plating. For comparison, TiN and TiC films were also deposited. Scanning electron microscopy (SEM), X-ray diffraction (XRD) and Auger electron spectroscopy (AES) were applied to investigate the modulation period thickness, microstructure and content depth distribution of the films, respectively. And microhardness and film/substrate adhesion were also analyzed using knoop tester and scratching method. The results showed that the multilayer films with different modulation period of 40-240 nm exhibit a modulation structure and the interface width is about 20∼30 nm. Microhardness of the multilayer films were not obviously improved compared to that of TiN and TiC film, and the reason was analyzed. In comparison to TiN film, film/substrate adhesion values of the multilayer films were deteriorated with the increasing of modulation period due to the brittle characteristics of TiC film. |
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Keywords: | TiN/TiC multilayer films Pulse biased arc ion plating Microhardness Film/substrate adhesion |
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