| 焊料空隙对条形量子阱激光器温度分布的影响 |
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| 引用本文： | 张蕾,崔碧峰,黄宏娟,郭伟玲,王智群,沈光地.焊料空隙对条形量子阱激光器温度分布的影响[J].中国激光,2007,34(9):1203-1207. |
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| 作者姓名： | 张蕾 崔碧峰 黄宏娟 郭伟玲 王智群 沈光地 |
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| 作者单位： | 北京工业大学光电子技术实验室，北京工业大学光电子技术实验室，北京工业大学光电子技术实验室，北京工业大学光电子技术实验室，北京工业大学光电子技术实验室，北京工业大学光电子技术实验室 北京100022，北京跟踪与通信技术研究所，北京100094，北京100022，北京100022，北京100022，北京100022，北京100022 |
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| 基金项目： | 国家973计划（2006CB604902）,国家863计划（2004AA311030）,十五国家科技攻关项目（2003BA316A01-01-08）,国家自然科学基金（60506012）,北京市科委重点项目（D0404003040221）,北京市教委项目（kz200510005003）和北京市人才强教计划项目（05002015200504）资助课题. |
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| 摘 要： | 针对量子阱半导体激光器建立了内部的热源分布模型,利用有限元方法模拟计算得到了条形量子阱半导体激光器的三维稳态温度分布,分析了芯片与热沉间的焊料空隙对芯片内部稳态温度分布的影响.模拟结果表明焊料空隙的位置和尺寸都将影响到芯片内部的温度分布,焊料空隙的存在将导致空隙上方的芯片内部出现局部热点.随着焊料空隙的增大,芯片内热点区域增大,温度增高.位于芯片的条形电极中心下方的焊料空隙引起的芯片内部局部温升最大,并且沿腔长方向光出射腔面上温度相对较高,易引起光出射腔面上正反馈的电热烧毁,与实验结果吻合.
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| 关 键 词： | 激光技术 半导体激光器 三维温度分布 焊料空隙 |
| 文章编号： | 0258-7025（2007）09-1203-05 |
| 收稿时间： | 2007/1/24 |
| 修稿时间： | 2007-01-24 |
Steady-State Temperature Distribution Changes of Stripe Quantum-Well Laser Caused by Solder Void |
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| ZHANG Lei , CUI Bi-feng , HUANG Hong-juan , GUO Wei-ling , WANG Zhi-qun , SHEN Guang-di.Steady-State Temperature Distribution Changes of Stripe Quantum-Well Laser Caused by Solder Void[J].Chinese Journal of Lasers,2007,34(9):1203-1207. |
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| Authors: | ZHANG Lei CUI Bi-feng HUANG Hong-juan GUO Wei-ling WANG Zhi-qun SHEN Guang-di |
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| Affiliation: | 1. Laboratory of Opto-Electronic Technology, Beijing University of Technology, Beijing 100022, China ;2. Beijing Institute of Tracking and Telecommunication Technology, Beijing 100094, China |
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| Abstract: | A model of internal heat source distribution is presented for quantum-well laser. Three-dimensional temperature distribution of the stripe quantum-well laser is simulated by using the finite element method, and the influence of solder voids between chip and heat sink on the steady-state temperature distribution is discussed. It is found that the chip′s internal temperature distribution is influenced by the position and size of solder voids. The localized hot spot may result from the nether solder voids, and the strong localized temperature rises and the hot spot expands with the expanding of the void′s dimension. Simulated result shows further that the strongest temperature rise is caused by solder voids under the center of the electrode stripe, and moreover, the highest temperature lies at the front facet. So catastrophic optical damage (COD)will be found at the front facet most possibly, which is in agreement with the test. |
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| Keywords: | laser technique semiconductor laser three-dimensional temperature distribution solder void |
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