| 镧对Sn3.5Ag0.5Cu钎料组织性能影响 |
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| 引用本文： | 吴敏.镧对Sn3.5Ag0.5Cu钎料组织性能影响[J].电子元件与材料,2008,27(2):39-41. |
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| 作者姓名： | 吴敏 |
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| 作者单位： | 辽宁石油化工大学,机械工程学院,辽宁,抚顺,113001 |
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| 摘 要： | 运用莱卡显微镜、扫描电镜和能谱分析等手段,研究了稀土元素La的添加量对Sn3.5Ag0.5Cu钎料及其与Cu基体焊接后微观组织及性能的影响。结果表明:添加不同含量的稀土La均能使钎料及其与Cu基体焊接后组织与性能得到改善,其中以w(La)达到0.05%时为最优,显微硬度及剪切强度分别提高14%和10.7%。键参数函数计算结果表明La具有"亲Sn"倾向,可细化钎料组织,降低IMC(界面金属间化合物)的长大驱动力。
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| 关 键 词： | 金属材料 Sn3.5Ag0.5Cu钎料 镧 组织 性能 |
| 文章编号： | 1001-2028（2008）02-0039-03 |
| 收稿时间： | 2007-10-08 |
| 修稿时间： | 2007年10月8日 |
Effect of La on microstructure and property of Sn3.5Ag0.5Cu solder |
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| WU Min.Effect of La on microstructure and property of Sn3.5Ag0.5Cu solder[J].Electronic Components & Materials,2008,27(2):39-41. |
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| Authors: | WU Min |
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| Affiliation: | WU Min (School of Mechanical Engineering,Liaoning Shihua University,Fushun 113001,Liaoning Province China) |
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| Abstract: | Effect of La on microstructure and property of Sn3.5Ag0.5Cu Solder was researched by adding various content to the solder by means of Leica, SEM and EDAX and so on. The results show that La can remarkably refine microstructure of the Sn3.5Ag0.5Cu solder and its IMC between solder and Cu substrate, enhances its mechanical property, especially La at 0.05% in the lead-free solder. Furthermore, The bond functional parameter calculating results show that La has higher affinity with Sn and the driving force for IMC growth was lowered by adding small content of La in Sn3.5Ag0.5Cu solder. |
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| Keywords: | metal material Sn3 SAg0 5Cu solder La microstructure property |
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