Techniques for fabrication of wafer-scale interconnections in multichip packages : John F. McDonald, How T. Lin, Hans J. Greub, Robert A. Philhower and Sanjay Dabral. <i>IEEE Trans. Compon. Hybrids mfg Technol.</i><strong>12</strong>(2), 195 (1989)期刊界 All Journals 搜尽天下杂志传播学术成果专业期刊搜索期刊信息化学术搜索

Techniques for fabrication of wafer-scale interconnections in multichip packages : John F. McDonald, How T. Lin, Hans J. Greub, Robert A. Philhower and Sanjay Dabral. IEEE Trans. Compon. Hybrids mfg Technol.12(2), 195 (1989)

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