Process integration of an interlevel dielectric (ILDO) module usinga building-in reliability approach |
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Authors: | Paulsen RE Kyono CS Wang Y Klein KM Lim I-S Tinkler S Bellamak B Odle DW Zhou Z Dahl P Giovanetto M Makwana J Patel S Reno C Lenahan PM Billman CA |
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Affiliation: | Motorola Inc., East Kilbride; |
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Abstract: | Process integration is approached from a built-in reliability perspective in order to develop a pre-metal inter-level dielectric (ILDO) module which may be integrated into a submicron CMOS process with embedded nonvolatile memory. The approach involves developing a fundamental understanding of the process parameters that modulate parasitics and impact reliability. The benefit of such an approach is a relatively simple process integration while achieving a highly manufacturable and reliable process. Several ILDO films have been characterized to understand the physical and chemical composition, process parameter dependencies, and gettering properties in order to define a process window from which to integrate the most manufacturable process |
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