| 适应无铅焊接的新型耐湿热环氧树脂的发展趋势 |
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| 引用本文： | 刘金刚,王德生,范琳,杨士勇.适应无铅焊接的新型耐湿热环氧树脂的发展趋势[J].绝缘材料,2004,37(4):60-64. |
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| 作者姓名： | 刘金刚 王德生 范琳 杨士勇 |
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| 作者单位： | 中科院化学所高技术材料研究室,北京,100080 |
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| 摘 要： | 在12篇艾献的基础上综述了近年来国内外研究开发了可应用于无铅焊接工艺的新型耐湿热环氧树脂的最新研究进展状况，重点介绍了联苯型、苯酚一芳烷基型以及双酚F型等可应用于无铅焊接工艺中的新型环氧树脂。
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| 关 键 词： | 环氧树脂 无铅焊接 耐湿热 环境友好 |
| 文章编号： | 1009-9239(2004)04-0060-05 |
| 修稿时间： | 2004年4月20日 |
Development of new moisture and thermal resistant epoxy compounds used in lead-free soldering |
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| LIU Jin_gang,WANG De_sheng,FAN Lin,YANG Shi_yong.Development of new moisture and thermal resistant epoxy compounds used in lead-free soldering[J].Insulating Materials,2004,37(4):60-64. |
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| Authors: | LIU Jin_gang WANG De_sheng FAN Lin YANG Shi_yong |
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| Abstract: | The increasing widely used lead-free solders in microelectronic assembly,on one hand,protect the environment,but on the other hand,impart great pressure on the present assembly procedure.The new epoxy compounds with higher thermal and moisture resistant properties used in the production of electronic components and printed circuit boards are greatly needed.The latest research and development of this field were summarized in this paper.Several important types of new epoxy were mainly introduced. |
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| Keywords: | epoxy lead-free soldering moisture and thermal resistant environment friendly |
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