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Computer aided process planning for tape automated bonding |
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| Authors: | Sundarraman Raghavan Graduate Student K. Srihari Ph.D. Assistant Professor |
| Affiliation: | Department Of Mechanical And Industrial Engineering T.J. Watson School of Engineering, Applied Science, And Technology State University Of New York, Binghamton, New York 13902-6000, USA |
| Abstract: | This paper describes the design and development of a knowledge based Computer Aided Process Planning (CAPP) system for Printed Circuit Board assembly. The domain considered uses both Surface Mount Technology (SMT) and Tape Automated Bonding (TAB) components. The structure and design of the CAPP system, and its inputs and outputs are discussed. |
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