理想绝缘金属基板前处理工艺的研究

采用阳极氧化工艺制备理想绝缘金属基板阳极氧化绝缘层。利用激光干涉法测量阳极氧化膜层在热冲击过程中的开裂温度。研究了铝板表面不同前处理工艺对金属基板绝缘层热开裂温度的影响，利用扫描电子显微镜（SEM）观察裂纹萌生的位置，结果表明阳极氧化前铝表面微观不平将使阳极氧化膜中产生一种孔隙率高的界面，热冲击过程中这种界面上容易萌生裂纹。

Study on pre- treatment process of ideal insulated metal substrates

An anodization process was used to produce an insulating layer of anodic film for ideal Insulated Metal Substrates (IMS). Electronic Speckle Pattern Interferometry was utilized to measurethe cracking temperature of anodic films in thermal shock experiments. The effect of pre-treatment process of aluminum plates on the thermal shock resistivity of anodic films was studied, and Scanning Electron Microscope (SEM) was used to observe where cracks originated. The analysis indicates thatthe unevenness of Al surface before anodization could cause the formation of a kind of interface where the porosity is higher in the anodic film, and cracks are easy to generate at the interfaces during theprocess of thermal shock.