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脉冲激光热力冲击效应对电沉积的作用
引用本文:张长桃,张朝阳,蔡明霞,丁伟,毛卫平,徐宇蓝.脉冲激光热力冲击效应对电沉积的作用[J].红外与激光工程,2015,44(1):65-70.
作者姓名:张长桃  张朝阳  蔡明霞  丁伟  毛卫平  徐宇蓝
作者单位:1.江苏大学机械工程学院激光技术研究所,江苏镇江212013
基金项目:国家自然科学基金(51275218);江苏省自然科学研究基金(BK2011522);江苏省精密与微细制造技术重点实验室开放基金
摘    要:脉冲激光电化学复合沉积利用激光的热力冲击效应可以有效提高沉积效率,改善加工质量。在所构建的纳秒脉冲激光电化学沉积加工系统中,利用激光辐照和电化学沉积的方法对铜进行了复合沉积试验。分析了激光的热力冲击效应对电沉积的作用机理,激光产生的力效应使阴极基片发生弹性变形,改变了电极电势和电流密度,提高了电沉积质量。通过加工试验,研究了激光平均功率密度对沉积质量和沉积效率的影响,并进行了讨论。试验结果表明,激光平均功率密度介于100~400 kW/cm2时可以获得较好的沉积层质量。激光平均功率密度在200 kW/cm2左右,沉积速率取得最大值。

关 键 词:脉冲激光    热力冲击    电沉积    复合加工
收稿时间:2014-05-11

Effect of pulsed laser thermal shock to electro-deposition
Zhang Changtao,Zhang Zhaoyang,Cai Mingxia,Ding Wei,Mao Weiping,Xu Yulan.Effect of pulsed laser thermal shock to electro-deposition[J].Infrared and Laser Engineering,2015,44(1):65-70.
Authors:Zhang Changtao  Zhang Zhaoyang  Cai Mingxia  Ding Wei  Mao Weiping  Xu Yulan
Affiliation:1.Institute of Laser Technology,School of Mechanical Engineering,Jiangsu University,Zhenjiang 212013,China
Abstract:Electrochemical deposition combine with pulse laser by using the thermal shock effect of laser, which can improve deposition efficiency and processing quality. The copper was deposited by a compound processing of laser and electrochemical in an experimental system established. The mechanism of the electro-deposition with the thermal shock of the laser was analyzed. These forces created by the laser make cathode substrate produce elastic deformation, changing the electrode potential and current density, improved the electro-deposition quality. Through the processing experiment, the effect of deposition efficiency and processing quality under different average laser power density were studied and discussed. The results show that when the average laser power density between the 100 kW/cm2 to 400 kW/cm2, the good deposition quality can be obtained. And the maximum deposition rate can be obtained when the average laser power density about 200 kW/cm2.
Keywords:pulse laser  thermal shock  electro-deposition  coupling processing
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