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| 电镀铬添加剂的发展与展望 | |
| 引用本文： | 赵黎云,钟丽萍,黄逢春. 电镀铬添加剂的发展与展望[J]. 电镀与精饰, 2001, 23(5): 9-12 |
| 作者姓名： | 赵黎云 钟丽萍 黄逢春 |
| 作者单位： | 山西大学化学系 |
| 摘 要： | 概述了电镀铬的发展历史，简要评述了各种镀铬工艺的现状，指出了研制新型的高效，低成本镀铬添加剂的必要性，综述了镀铬添加剂的发展概况，对比分析了各类添加剂的作用。并对今后镀铬添加剂的研究做出了展望。 |
| 关 键 词： | 添加剂 阴极电流效率 催化剂 |
| 文章编号： | 1001-3849(2001)05-0009-04 |
Development and Prospect for Chromium Electroplating Additives |
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| ZHAO Li yun,ZHONG Li ping,HUANG Feng chun. Development and Prospect for Chromium Electroplating Additives[J]. Plating & Finishing, 2001, 23(5): 9-12 | |
| Authors: | ZHAO Li yun ZHONG Li ping HUANG Feng chun |
| Abstract: | The history and present situation of chromium plating technology are summarized in this paper. It is pointed out that it is necessary to study and develop new chromium electroplating additives characterized by the advantage of high effieicency and low production cost. In this paper, the technology evolution for the additives is reviewed, the effect of various kinds of additives are analyzed comparatively, and finally, the future works on the new additives are prospected. |
| Keywords: | chromium electroplating additives cathodic current efficiency catalyst |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |