液固分离法近净成形SiC_p/Al电子封装壳体的组织和性能(英文)

采用液固分离工艺制备高SiC体积分数Al基电子封装壳体(54%SiC,体积分数),借助光学显微镜和扫描电镜分析壳体复合材料中SiC的形态分布及其断口形貌,并测定其物理性能和力学性能。结果表明:SiCp/Al壳体复合材料中Al基体相互连接构成网状,SiC颗粒均匀镶嵌分布于Al基体中。复合材料的密度为2.93 g/cm3,致密度为98.7%,热导率为175 W/(m·K),热膨胀系数为10.3×10-6K-1(25~400°C),抗压强度为496 MPa,抗弯强度为404.5 MPa。复合材料的主要断裂方式为SiC颗粒的脆性断裂同时伴随着Al基体的韧性断裂,其热导率高于Si/Al合金的,热膨胀系数与芯片材料的相匹配。

Microstructure and properties of SiCp/Al electronic packaging shell produced by liquid-solid separation

The electronic packaging shell of high silicon carbide （54%SiC, volume fraction） aluminum-based composites was produced by liquid-solid separation technique. The characteristics of distribution and morphology of SiC as well as the shell’s fracture surface were examined by optical microscopy and scanning electron microscopy, and the thermo-physical and mechanical properties of the shell were also tested. The results show that Al matrix has a net-like structure while SiC is uniformly distributed in the Al matrix. The SiCp/Al composites have a low density of 2.93 g/cm^3, and its relative density is 98.7%. Thermal conductivity of the composites is 175 W/（·K）, coefficient of thermal expansion （CTE） is 10.3×10^-6 K-1 （25-400 ℃）, compressive strength is 496 MPa, bending strength is 404.5 MPa, and the main fracture mode is brittle fracture of SiC particles accompanied by ductile fracture of Al matrix.Its thermal conductivity is higher than that of Si/Al alloy, and its CTE matches with that of the chip material.