| 三维集成大功率同步整流器的研究与设计 |
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| 引用本文： | 杨勋勇,王建卫,张涵,马奎,杨发顺. 三维集成大功率同步整流器的研究与设计[J]. 电子测试, 2022, 0(3): 10-13. DOI: 10.3969/j.issn.1000-8519.2022.03.002 |
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| 作者姓名： | 杨勋勇 王建卫 张涵 马奎 杨发顺 |
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| 作者单位： | 贵州工程应用技术学院,贵州毕节,551700,贵州大学大数据与信息工程学院,贵州贵阳,550025 |
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| 摘 要： | 实现同步整流能够有效提高次级整流效率,并且有利于实现电源模块的小型化.将同步整流器中的控制电路和整流桥分别制作在两层芯片上,然后堆叠两层芯片并通过TSV实现层间信号互连,不仅能进一步提高集成度,还能有效降低引线延迟和功耗.设计了一种大功率同步整流器,仿真实现了输出电压为5V、最大输出电流为13.38A、输出电压和输出电...
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| 关 键 词： | 三维集成 大功率 同步整流 TSV 电气连接 |
Research and Design of 3D Integrated High Power Synchronous Rectifier |
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| Yang Xunyong,Wang Jianwei,Zhang Han,Ma Kui,Yang Fashun. Research and Design of 3D Integrated High Power Synchronous Rectifier[J]. Electronic Test, 2022, 0(3): 10-13. DOI: 10.3969/j.issn.1000-8519.2022.03.002 |
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| Authors: | Yang Xunyong Wang Jianwei Zhang Han Ma Kui Yang Fashun |
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| Affiliation: | (Guizhou University of Engineering science,Bijie Guizhou,551700;College of Big Data and Information Engineering,Guizhou University,Guiyang Guizhou,550025) |
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| Abstract: | Synchronous rectification can effectively improve the secondary rectification efficiency and facilitate the miniaturization of the power module.The control circuit and the rectifier bridge in the synchronous rectifier are respectively fabricated on two layers of chips,and then the two layers of chips are stacked and the inter-layer signal interconnection is realized by the TSV,which not only further improves the integration degree,but also effectively reduces the lead delay and power consumption.A high-power synchronous rectifier is designed.The simulation achieves an output voltage of 5V,a maximum output current of 13.38A,a temperature coefficient of output voltage and output current of 37.289ppm and 37.266ppm,and a load regulation rate of 7.96mV/A.According to the function,scale and thermal stability of the high-power synchronous rectifier circuit,the layout is rationally planned,and the four rectifier devices are planned on the rectifier chip,the control circuit and the high-voltage step-down circuit,and the switching circuit are planned on the control chip.Corresponding signal interconnection TSV and heat dissipation TSV,the layout of three-dimensional integrated high-power synchronous rectifier is designed,and the two-layer chip and three-dimensional stacked chip are verified by DRC,LVS and three-dimensional electrical interconnection,and the verification results are correct. |
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| Keywords: | 3D integration high power synchronous rectification TSV electrical connection |
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