某新型ATCA插箱热学仿真分析及优化设计

采用ATCA技术标准的新一代电子设备集成密度和功率密度更高，由此带来的散热要求也相应增加。文中以某新型ATCA插箱（单板功率高达300 W）为例，利用FLOTHERM软件分别进行了模块级与插箱级热学仿真分析。文中研究了ATCA刀片式板卡的冷板结构参数对芯片散热性能的影响，在此基础上进一步研究了风道设计及风机选型对ATCA插箱散热性能的影响，并根据热学仿真分析结果为ATCA刀片式板卡及其插箱的结构设计提出了优化建议。文中所介绍的热学仿真分析思路及优化方法可为新型电子设备风冷插箱的散热设计提供参考。

Thermal Simulation and Optimization Design for a Novel ATCA Chassis

With the rapid increase of integration density and heat flux of the new electronic equipment with ATCA standard, great pressure has been placed on its cooling. In this paper, the thermal simulation for a novel ATCA chassis (The PCB power is 300 W) at module level and chassis level are performed based on FLOTHERM. The effect of the plate-fin parameters on the cooling of electronic chips is firstly researched and then the effect of wind path design and fan selection on the cooling of ATCA chassis is studied. Finally optimization suggestions on the structure design of ATCA modules and chassis are provided. The thermal simulation and optimization methods introduced in this paper can be used as reference for the air cooling chassis design of the new electronic equipment.