高密度3-D封装技术的应用与发展趋势

高密度3-D封装技术是国内外近几年飞速发展的微电子封装技术。它在2-D平面基础上向立体化发展,实现了一种新的更高层次的混合集成,因而具有更高的组装密度、更强的功能、更优的性能、更小的体积、更低的功耗、更快的速度、更小的延迟等优势。该技术正在加速未来电子整机系统的微小型化。主要介绍了近年来3-D封装应用状况和一种新型的封装技术——系统上封装SOP(System-on-Package)。

Application and development trend of high density three-dimensional packaging technologies

High density three-dimensional packaging technologies are rapid developing micro-electronic packaging technologies at home and abroad in recent years. It develops into the three-dimensional space on the basis of the two-dimensional plane. It implements a new and higher level of hybrid integration with higher assemble density, more strong features, better performance, smaller size, lower power consumption, faster speed, smaller delay, etc. Its advantages are accelerating the realization of miniaturization of future e-machine systems. Mostly introduces the latest application status of three-dimensional packaging technologies near these years and a novel packaging technology: System-on-Package.