Affiliation: | 1. Shenzhen High Density Electronic Packaging and Device Assembly Key Laboratory, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, People’s Republic of China 2. Shenzhen Key Laboratory of Special Functional Materials, College of Materials Science and Engineering, Shenzhen University, Shenzhen, 518060, China 3. Department of Electronics Engineering, The Chinese University of Hong Kong, Hong Kong, People’s Republic of China 4. School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, 30332, USA
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