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| 半导体激光钎焊工艺参数对QFP器件微焊点强度的影响 | |
| 引用本文： | 姚立华,薛松柏,王鹏,刘琳. 半导体激光钎焊工艺参数对QFP器件微焊点强度的影响[J]. 焊接学报, 2005, 26(10): 90-92 |
| 作者姓名： | 姚立华 薛松柏 王鹏 刘琳 |
| 作者单位： | 南京航空航天大学,材料科学与工程学院,南京,210016 |
| 摘 要： | 采用90W半导体激光软钎焊系统对方形扁平式封装器件（QFP）进行了焊接试验研究，并对不同激光输出功率下形成的QFP结构焊点进行了力学性能比较。研究结果表明，半导体激光软钎焊不仅能够大幅度地提高Sn—Ag—Cu钎料QFP微焊点的抗拉强度，而且也能够明显地改善Sn—Pb钎料QFP微焊点的抗拉强度。在相同的钎料成分下，半导体激光输出功率直接影响QFP焊点的抗拉强度，研究结果可为提高QFP微焊点强度和可靠性提供一个有效的解决方法。 |
| 关 键 词： | 激光软钎焊 方形扁平式封装器件 抗拉强度 |
| 文章编号： | 0235-360X（2005）10-90-03 |
| 收稿时间： | 2005-07-29 |
| 修稿时间： | 2005-07-29 |
Effect of diode-laser parameters on tensile strength of QFP micro-joints |
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| YAO Li-hu,XUE Song-bai,WANG Peng and LIU Lin. Effect of diode-laser parameters on tensile strength of QFP micro-joints[J]. Transactions of The China Welding Institution, 2005, 26(10): 90-92 | |
| Authors: | YAO Li-hu XUE Song-bai WANG Peng LIU Lin |
| Affiliation: | College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China,College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China,College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China and College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China |
| Abstract: | Soldering technology for quad flat pack devices(QFP) were studied by means of 90W diode-laser soldering system and the mechanical properties of micro-joints of QFP were compared with different laser power.Results indicate that diode-laser soldering can obviously improve both the tensile strength of the joints with Sn-Ag-Cu solder and the strength of the joints with Sn-Pb solder.The diodelaser output power directly influences the tensile strength of the micro-joints of QFP with the same solders.These results will provide a good method for improving the strength and reliability of fine pitch QFP devices. |
| Keywords: | laser soldering QFP tensile strength |
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