| PI/石墨微片半导电复合薄膜的制备与表征 |
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| 引用本文： | 吴雪松,刘立柱,张海军,翁凌,王诚.PI/石墨微片半导电复合薄膜的制备与表征[J].塑料工业,2014,42(10):21-24,54. |
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| 作者姓名： | 吴雪松 刘立柱 张海军 翁凌 王诚 |
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| 作者单位： | 1. 哈尔滨理工大学材料科学与工程学院,黑龙江哈尔滨,150040
2. 哈尔滨理工大学工程电介质及其应用教育部重点实验室,黑龙江哈尔滨,150080 |
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| 摘 要： | 通过乙醇超声处理膨胀石墨的方法制备石墨微片,并用原位聚合法制备聚酰亚胺/石墨微片复合薄膜;探讨了复合薄膜的结构、微观形态;讨论了石墨微片的含量对复合薄膜的体积电阻率、表面电阻率、力学性能以及热稳定性的影响。结果表明,石墨微片能够在聚酰亚胺基体中均匀分布,并对复合薄膜亚胺化过程没有影响,复合薄膜亚胺化完全。复合薄膜较纯膜力学性能有所下降,热稳定性提高,在石墨微片质量分数为4%时,达到渗滤阈值,体积电阻率和表面电阻率均可下降到108数量级,达到半导电复合薄膜的要求。
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| 关 键 词： | 聚酰亚胺 石墨微片 复合薄膜 体积电阻率 表面电阻率 |
Synthesis and Characteristics of Polyimide/Graphite Microchip Semiconductor Composite Film |
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| WU Xue-song,LIU Li-zhu,ZHANG Hai-jun,WENG Ling,WANG Cheng.Synthesis and Characteristics of Polyimide/Graphite Microchip Semiconductor Composite Film[J].China Plastics Industry,2014,42(10):21-24,54. |
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| Authors: | WU Xue-song LIU Li-zhu ZHANG Hai-jun WENG Ling WANG Cheng |
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| Affiliation: | WU Xue-song;LIU Li-zhu;ZHANG Hai-jun;WENG Ling;WANG Cheng;College of Materials Science and Engineering,Harbin University of Science and Technology;Key Laboratory of Engineering Dielectric and Its Application,Ministry of Education,Harbin University of Science and Technology; |
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| Abstract: | |
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| Keywords: | Polyimide Graphite Microchip Composite Film Surface Resistivity Volume Resistivity |
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