Diffusion bonding of alumina to steel using soft copper interlayer

The diffusion bonding of a low steel to alumina has been studied in the present work. Thin foils of a soft metal (copper) were used to reduce the effects of the residual stresses produced in the joint by thermal expansion mismatch. The strength of the joint was found to be influenced by the bonding parameters, but principally by the oxygen content both on the surface and in the copper matrix. The diffusion bonds have been mechanically tested using a three-point bending test. Maximum bending strengths of 100 MPa were achieved by using a 0.1 mm copper foil, and bonding in a oxidizing atmosphere (P _{O 2}=10₄Pa). SEM and EDS investigations have shown the presence of reaction products in the copper-alumina interface which controls the mechanical properties of the joint.