| 微互连接头的蠕变数值模拟及失效寿命预测 |
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| 引用本文： | 何旭东,;李佳洪.微互连接头的蠕变数值模拟及失效寿命预测[J].机械工程师,2014(9):128-130. |
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| 作者姓名： | 何旭东 ;李佳洪 |
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| 作者单位： | [1]哈尔滨汽轮机厂有限责任公司,哈尔滨150090; [2]哈尔滨华德学院材料工程系,哈尔滨150000 |
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| 摘 要： | 电子封装中的微互连接头失效是电子设备的主要失效原因之一.文中根据实际封装期间建立了一个1/8的板级封装组件有限元模型.对微互连接头的蠕变变形进行了数值模拟,并依据疲劳寿命模型进行了失效预测.模拟中的互连接头分别采用了两种钎料（Sn-3.8Ag-0.7Cu和63Sn-37Pb）进行定义,对比了两种钎料的变形及寿命.
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| 关 键 词： | 互连接头 数值模拟 蠕变 失效预测 |
Creep Simulation and Life Prediction of Micro-solder Interconnects |
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| Affiliation: | HE Xudong ,LI Jiahong( 1.Harbin Turbine Co., Ltd., Harbin 150090, China; 2.Harbin Huade College, Harbin 150000, China ) |
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| Abstract: | Electronic solder joints failure is one of the most important failure reason for electronic equipments. In this paper, a one-eighth finite element model is established for pakage assembly analysis. Creep strain distribution is simulated under thermal eyeling loading condition. According existing fatigue model, failure cycle numbers of two types of solder joints （Sn-3.SAg-0.7Cu and 63Sn-37Pb） are predicted based on the strain simulation resutls. |
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| Keywords: | micro-solder interconnects numerical simulation creep failure prediction |
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