| CSP引发内存封装技术的革命 |
| |
| 引用本文： | 鲜飞.CSP引发内存封装技术的革命[J].印制电路信息,2004(9):14-16,29. |
| |
| 作者姓名： | 鲜飞 |
| |
| 作者单位： | 烽火通信科技股份有限公司,430074 |
| |
| 摘 要： | 简要介绍了几种内存芯片封装技术的特点。CSP是内存芯片封装技术的新概念,它的出现促进内存芯片的发展和革新,并将成为未来高性能内存的最佳选择。
|
| 关 键 词： | 内存 薄型小尺寸封装 小型球栅阵列封装 芯片级封装 |
CSP Causes the Revolution of Memory Chip Package Technology |
| |
| Xian Fei.CSP Causes the Revolution of Memory Chip Package Technology[J].Printed Circuit Information,2004(9):14-16,29. |
| |
| Authors: | Xian Fei |
| |
| Abstract: | Characteristics of several advanced chip package technology are introduced in the paper. CSP is a new concept of memory chip package technology. CSP has developed and innovated the memory chip since it was appeared. It is believed that CSP will be the best choice of the memory with high performance. |
| |
| Keywords: | memory TSOP tinyBGA CSP |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
