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蓝宝石的焊接方法研究现状
引用本文:李书齐,史维琴,李华卿,崔炜.蓝宝石的焊接方法研究现状[J].焊接,2019(3):18-23,I0025.
作者姓名:李书齐  史维琴  李华卿  崔炜
作者单位:常州工程职业技术学院,江苏常州,213164;河海大学,江苏常州,213022
基金项目:国家自然科学基金;国家自然科学基金;江苏省自然科学基金;江苏省自然科学基金
摘    要:针对目前的研究较为偏重蓝宝石焊接的工艺效果,在蓝宝石/焊接材料界面结合机理和反应动力学方面的研究仍不够深入的问题。综述了蓝宝石焊接过程中的界面结合和热应力两个核心问题。蓝宝石具有较高的化学惰性,不易与焊缝填充材料发生扩散和化学反应,导致界面结合问题。蓝宝石的热膨胀系数较低,与焊缝填充材料的热膨胀系数可能具有较大差异,在焊接的热循环中会导致加大的热应力。归纳与总结了三种主要焊接方法,即陶瓷粉末烧结连接、扩散焊和钎焊,焊接过程中蓝宝石与焊接材料的反应原理、界面结合过程和接头强度,提出目前研究中所存在的主要问题及建议未来应关注的内容,希望对该领域的研究及应用提供参考。

关 键 词:蓝宝石  焊接  科学问题  研究现状
收稿时间:2018/10/19 0:00:00

A review of sapphire welding and joining
Li Shuqi,Shi Weiqin,Li Huaqing,Cui Wei.A review of sapphire welding and joining[J].Welding & Joining,2019(3):18-23,I0025.
Authors:Li Shuqi  Shi Weiqin  Li Huaqing  Cui Wei
Affiliation:(Changzhou Vocational Institute of Technology, Changzhou 213164, Jiangsu, China;Hohai University, Changzhou 213022, Jiangsu, China)
Abstract:Aiming at that current research in welding and joining of sapphire mainly focuses on the processing effectiveness, and that the sapphire/metal interface bonding mechanism and reaction dynamics have not been sufficiently investigated, two main concerns of interfacial bonding and thermal stresses are reviewed. Because of sapphire’s chemical inertia, diffusion and reaction between sapphire and weld seam filler materials is very difficult to achieve, which leads to interfacial bonding problems. And because coefficient of thermal expansion of sapphire is relatively low, which can be different from the filler materials, significant thermal stress can be produced in the joints. Three mainstream methods for sapphire welding, i.e. ceramics powder sintering, diffusion bonding and brazing, are reviewed. The reaction mechanism, bonding process and mechanical properties of the sapphire joints are summarized. Noticeable issues and aspects that shall be concerned in the future is proposed. It is expected to provide a valuable reference for the fundamental research and engineering applications in this field.
Keywords:sapphire  welding  scientific issues  review
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