降低电镀镍/金印制板的不良率

随着电子工业的快速发展,高密度集成电路和BGA封装器件也广泛用于军用电子产品,新的器件和焊接工艺对印制电路板的表面可焊涂覆层提出了新的要求,其不但要求涂覆层有良好的可焊性,而且要求涂覆层平整,印制板电镀镍/金涂层不但表面平整,可焊性好而且具有较好的三防性能和较长的存放期,因此,电镀镍/金印制板正逐渐被应用于高密度的军用电子产品,本文就印制板电镀镍/金过程中出现的问题进行探讨和交流。

Reducing the rate of undesirable nickel gold coating printed board

Along with the rapid development of electronic industry,more and more high density printed board and BGA packaged components have been widely adopted in military electronic products.The new components and soldering technology have further requirements of the surface solderable coating of printed board,not only the good solderability but also the better evenness of the coating.The nickel /gold coating printed board has the performance of better even and solderable coating,betting three proofings(moisture pro...