Transmission electron microscope study of a directionally solidified Cu-MgCu2 eutectic

The crystallography and the interface structure of a unidirectionally solidified Cu-MgCu₂ eutectic alloy have been examined by transmission electron microscopy. The microstructure of the eutectic was found to be lamellar and regularly interrupted by faults. The preference of the particular orientation relationship could not be explained by relative atomic densities of the planes comprising the interface. Based on the defect contrast observed and extinction distance calculations, it is suggested that the fine array of defects observed at the interface may be characterized as steps with step vectors parallel to or Dislocations were also observed at the interface but they were rarely regular.