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世界半导体设备的“十大”发展趋势
引用本文:翁寿松.世界半导体设备的“十大”发展趋势[J].电子工业专用设备,2004,33(4):4-8.
作者姓名:翁寿松
作者单位:无锡市罗特电子有限公司,江苏,无锡,214002
摘    要:讨论了世界半导体设备的“十大”发展趋势,如设备与工艺互动化、设备加工晶圆大尺寸化、加工晶圆单片化、组合化、高精度化、全自动化、制造商垄断化、高价格化、研制联合化和用户化。

关 键 词:半导体设备  发展趋势  晶圆
文章编号:1004-4507(2004)04-0004-05
修稿时间:2004年2月5日

The "Ten Major" Developmental Trend of the World Semiconductor Equipment
WENG Shou-song.The "Ten Major" Developmental Trend of the World Semiconductor Equipment[J].Equipment for Electronic Products Marufacturing,2004,33(4):4-8.
Authors:WENG Shou-song
Abstract:The "Ten Major" developmental trend of the world semiconductor equipment are discussed, such as the equipment with the technology relate each other , the equipment process large size wafer, the equipment process single wafer, the equipment combination, the equipment high precision, the equipment all automation, the equipment manufacturer monopolize, the equipment high price, the equipment manufacture unite and the equipment relate user.
Keywords:Semiconductor equipment:  Developmental trend:  Wafer
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