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光电印制电路板的发展评述(1)——光电印制电路板的基本概述(上)
引用本文:张家亮.光电印制电路板的发展评述(1)——光电印制电路板的基本概述(上)[J].印制电路信息,2006,24(10):17-21.
作者姓名:张家亮
作者单位:南美覆铜板厂有限公司,528231
基金项目:江苏省科技厅省科技发展计划(社会发展)项目
摘    要:介绍了光电印制电路板的基本概念,简述了光电印制电路板的发展现状和光互连的结构原理,比较了光互连相对于电互连的优点,垂直共振腔表面放射激光制造技术获得的新进展促进了光电印制电路板的发展,概括了光电印制电路板的三个时代的特点。

关 键 词:光电印制电路板  光互连  电互连  垂直共振腔表面放射激光(VCSEL)  发展

Review of Progress about Optical-Electronic Circuit Boards(1): Basic Review of EOCB
Zhang Jialiang.Review of Progress about Optical-Electronic Circuit Boards(1): Basic Review of EOCB[J].Printed Circuit Information,2006,24(10):17-21.
Authors:Zhang Jialiang
Affiliation:Zhang Jialiang
Abstract:In the paper, The basic concept of EOCB was introduced. Development status of EOCB and principle of structure to optical interconnect were reviewed briefly. Difference of optical interconnect and electronic interconnect was compared. Development of VCSEL technology hastened the progress of EOCB. At the same, characteristic of three generation EOCB was generalized.
Keywords:EOCB optical Interconnect electronic interconnect vertical cavity surface emitting laser (VCSEL) development  
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