| 单面电路板通孔再流焊接技术 |
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| 引用本文： | 褚玉福,袁娅婷. 单面电路板通孔再流焊接技术[J]. 电子工艺技术, 2003, 24(2): 59-61,66 |
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| 作者姓名： | 褚玉福 袁娅婷 |
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| 作者单位： | 陕西凌华电子有限公司,陕西,宝鸡,721006;陕西凌华电子有限公司,陕西,宝鸡,721006 |
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| 摘 要： | 从理论和实用的角度,阐述了SMD和通孔插装混合安装的高密度组装的电子产品在大规模流水生产中使用再流焊工艺的可行性,并对相关设备作了简单的介绍。
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| 关 键 词： | 通孔再流焊接 熔化焊料的表面张力 焊膏的特殊涂覆 |
| 文章编号： | 1001-3474(2003)02-0059-03 |
Pin-through-hole Reflow Soldering Technology for Single-sided Board |
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| CHU Yu-fu,YUAN Ya-Ting. Pin-through-hole Reflow Soldering Technology for Single-sided Board[J]. Electronics Process Technology, 2003, 24(2): 59-61,66 |
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| Authors: | CHU Yu-fu YUAN Ya-Ting |
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| Abstract: | From theory and practice,expound the feasibility of reflow technology of high dense electronic assemblies mixed pin-through-hole and SMD during large scale production,introduce the correlation equipment. |
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| Keywords: | Pin-through-hole reflow soldering Surface tension of melten solder Special dispensing for solder paste Document Code:A Article ID:1001-3474(2003)02-0059-03 |
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