金刚石/ 铜在微波功率组件热设计中的应用研究

随着军用雷达电子装备的功率和功率密度的不断增加,对微波功率组件的散热要求越来越高,传统组件材料已经无法满足日益增加的热流密度要求,对新型热管理材料的需求变得愈加迫切.金刚石/铜具有优异的热传导性能和与芯片匹配的热膨胀系数,是一种极具竞争力的可用于组件封装的热设计材料.文中对金刚石/铜在微波功率组件工程应用中面临的问题开展了相关试验研究,通过热性能仿真测试以及振动、冲击等环境试验验证了其在微波功率组件热设计中应用的可行性.

Application Research of Diamond / Copper in Solid-state Microwave Power Devices

With the continuous increase of the power and the power density of military radar electronic equipment, the heat dissipation requirement of microwave power components becomes more and more high. Traditional materials have already been unable to deal with the continuous increasing heat flux, innovative thermal management materials become necessary. As a competent electronic packaging material, diamond/ copper composites have excellent performances such as high thermal conductivity and adjustable CTE. In this paper,experimental studies are conducted for the engineering applications of diamond/ copper in microwave power components, the feasibility is verified by simulation tests of its thermal properties and environmental tests such as vibration and shock.