| 钨铜复合材料研究现状与展望 |
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| 引用本文： | 刘克明,谌昀,谢仕芳,万珍珍,陆德平.钨铜复合材料研究现状与展望[J].热处理技术与装备,2012(5):40-42,47. |
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| 作者姓名： | 刘克明 谌昀 谢仕芳 万珍珍 陆德平 |
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| 作者单位： | 江西省科学院江西省铜钨新材料重点实验室,江西南昌330029 |
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| 基金项目： | 江西省科学院国家级预研项目（2010-YGY-04）;江西省自然科学基金项目（20114BAB206016）;江西省铜钨新材料重点实验室开放基金项目（2011-TW-02） |
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| 摘 要： | 钨铜复合材料具有高导电导热性能、低膨胀系数、良好的高温强度和抗电弧烧蚀性能,在电气工程、机械加工及电子信息等领域获得了广泛应用。介绍了钨铜复合材料的传统工艺及制备新技术,综述了其在电器开关、电极、微电子及军工等领域的应用,并对其制备技术和应用开发进行了展望。
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| 关 键 词： | 钨铜复合材料 制备技术 应用开发 |
Current Status and Development of W-Cu Composite |
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| LIU Ke-ming,CHEN Yun,XIE Shi-fang,WAN Zhen-zhen,LU De-ping.Current Status and Development of W-Cu Composite[J].Heat Treatment Technology and Equipment,2012(5):40-42,47. |
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| Authors: | LIU Ke-ming CHEN Yun XIE Shi-fang WAN Zhen-zhen LU De-ping |
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| Affiliation: | (Jiangxi Key Laboratory for Advanced Copper and Tungsten Materials, Jiangxi Academy of Sciences, Nanchang Jiangxi 330029, China) |
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| Abstract: | W-Cu composites have been used widely in electrical engineering, machining and electronic information fields due to the high electric and thermal conductivity, low thermal expansion coefficient, good elevated temperature strength and arc corrosion resistance. The traditional and modem preparation methods of W-Cu composites were introduced. The application in electric switch, electrode, microelectronic device and military fields was reviewed. The prospect of preparation method and application development was discussed. |
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| Keywords: | W-Cu composite preparation method application development |
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