| 倒装芯片凸焊点的UBM |
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| 引用本文： | 郭江华,王水弟,张忠会,胡涛,贾松良. 倒装芯片凸焊点的UBM[J]. 半导体技术, 2001, 26(6): 60-64 |
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| 作者姓名： | 郭江华 王水弟 张忠会 胡涛 贾松良 |
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| 作者单位： | 清华大学微电子所,北京 100084;清华大学微电子所,北京 100084;清华大学微电子所,北京 100084;清华大学微电子所,北京 100084;清华大学微电子所,北京 100084 |
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| 摘 要： | 介绍了倒装芯片凸焊点的焊点下金属（UBM）系统,讨论了电镀Au凸焊点用UBM的溅射工艺和相应靶材、溅射气氛的选择,给出了凸焊点UBM质量的考核试验方法和相关指标。
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| 关 键 词： | 倒装芯片 凸焊点 UBM 微电子封装 |
| 文章编号： | 1003-353X(2001)06-0060-05 |
| 修稿时间： | 2000-12-14 |
UBM of bumps for flip chip |
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| GUO Jiang-hua,WANG Shui-di,ZHANG Zhong-hui,HU Tao,JIA Song-liang. UBM of bumps for flip chip[J]. Semiconductor Technology, 2001, 26(6): 60-64 |
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| Authors: | GUO Jiang-hua WANG Shui-di ZHANG Zhong-hui HU Tao JIA Song-liang |
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| Abstract: | Various of UBM (Under Bump Metallurgy or Under Bump Metallization) systems for flip chip bumping are presented. This paper discussed the manufacturing of UBM for electroplating gold bumping, concerning in the sputtering process and selections of targets and sputtering gas. Test methods and related standards associated with UBM qualities are given. |
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| Keywords: | flip chip bump UBM microelectronics packaging |
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