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Effect of tensile stress on microstructure evolution of Al-Cu-Mg-Ag alloys
作者姓名:周杰  刘志义  李云涛  刘延斌  夏卿坤  段水亮
作者单位:School of Materials Science and Engineering, Central South University, Changsha 410083, China
基金项目:Project(2005CB623705-04) supported by the National Basic Research Program of China
摘    要:The effect of tensile stress on thermal microstructure evolution of Ω phase in an AI-Cu-Mg-Ag alloy with high Cu/Mg ratio and higher Ag content was investigated by transmission electron microcopy (TEM) .The samples were aged at 200 ℃ for 1 h (T6 condition), then thermal exposed at 250 ℃ for 100 h with and without a tensile stress (130 MPa), respectively. The results indicate that Ω precipitates uniformly disperse in the matrix as a major precipitate after artificially aging at 200℃ for 1 h (T6 condition). Exposed at 250℃ for 100 h without stress, Ωprecipitates dissolve dramatically. Whereas, during stress exposure they coarsen unexpectedly rather than dissolve into matrix. It can be deduced that the stress retards the redissolution of Ω phase.

关 键 词:    合金  Ω相  热处理技术
收稿时间:2007-07-15
修稿时间:2007-09-10

Effect of tensile stress on microstructure evolution of Al-Cu-Mg-Ag alloys
ZHU Jie, LIU Zhi-yi, LI Yun-tao, LIU Yan-bin, XIA Qing-kun, DUAN Shui-liang.Effect of tensile stress on microstructure evolution of Al-Cu-Mg-Ag alloys[J].Transactions of Nonferrous Metals Society of China,2007,17(A01):322-325.
Authors:ZHU Jie  LIU Zhi-yi  LI Yun-tao  LIU Yan-bin  XIA Qing-kun  DUAN Shui-liang
Affiliation:ZH0U Jie, LIU Zhi-yi, LI Yun-tao, LIU Yan-bin, XIA Qing-kun, DUAN Shui-liang
Abstract:
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