Interfacial reactions in the Sn-(Cu)/Ni,Sn-(Ni)/Cu,and Sn/(Cu,Ni) systems |
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Authors: | Sinn-Wen Chen Shyr-Harn Wu Shou-Wei Lee |
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Affiliation: | (1) Department of Chemical Engineering, National Tsing Hua University, Hsin-Chu, Taiwan 300, Republic of China |
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Abstract: | Specimens with the Sn/Cu/Sn/Ni/Sn/Cu/Sn structure reacted at 200°C are prepared and examined. The Cu6Sn5 and Cu3Sn phases are formed at the Sn/Cu interface, and the Cu6Sn5 and Ni3Sn4 phases at the Sn/Ni interface. The reaction path in the original Cu/Sn/Ni part of the specimen is Cu/Cu3Sn/Cu6Sn5/Sn/Cu6Sn5/Ni3Sn4/Ni. The peculiar phenomenon of the Cu6Sn5 phase forming at both sides of the Sn phase is illustrated using the Sn-Cu-Ni phase diagram with a very wide compositional-homogeneity
range of the Cu6Sn5 phase. Interfacial reactions at 240°C between pure Sn and (Cu,Ni) alloys of various compositions are determined. The Cu6Sn5 phase is formed when the NI content is less than 30 wt.%, and the Ni3Sn4 phase is formed when the Ni content is higher than 40 wt.%. When the Ni content is between 35 wt.% and 40 wt.%, both Cu6Sn5 and Ni3Sn4 phases are formed. It is also noticed that the formation of the Cu3Sn phase at the Sn/(Cu,Ni) interface is suppressed with more than 1wt.%Ni addition in the substrate. |
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Keywords: | Sn/Cu interface Cu6Sn5 Cu3Sn Sn/Ni interface |
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