| 圆片级封装的新颖对准技术 |
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| 引用本文： | C.Brubaker,T.Glinsner,P.Lindner,M.Tischler,高仰月.圆片级封装的新颖对准技术[J].电子工业专用设备,2006,35(7):20-23. |
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| 作者姓名： | C.Brubaker T.Glinsner P.Lindner M.Tischler 高仰月 |
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| 作者单位： | EV Group US Inc.，3701E.University Drive，Suite 300 Phoenix AZ85034，USA，EVGroup，St.Florian，A-4780 Schaerding，Austria，EVGroup，St.Florian，A-4780 Schaerding，Austria，EVGroup，St.Florian，A-4780 Schaerding，Austria |
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| 摘 要： | 对于3D互连、圆片级封装(WLP)和先进的MEMS器件的圆片键合,精密对准是一项关键技术,不同的MEMS,常常包含双面加工处理,而IC和CMOS制造业则只利用单面加工处理步骤,因此,圆片到圆片的对准必须使用设置在键合界面(也就是面对面)中的对准标记。论述了面对面对准方法的主要步骤,最新结果报导,用一种特殊开发的对准系统获得了≤1μm的对准精度。设备主要是为圆片对圆片的对准和键合而设计。
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| 关 键 词： | 3D互连 对准 键合 MEMS 封装 多层叠加 |
| 文章编号： | 1004-4507(2006)07-0020-04 |
Novel Alignment Technologies For Wafer Level Packaging |
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| C.Brubaker,T.Glinsner,P.Lindner,M.Tischler.Novel Alignment Technologies For Wafer Level Packaging[J].Equipment for Electronic Products Marufacturing,2006,35(7):20-23. |
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| Authors: | CBrubaker TGlinsner PLindner MTischler |
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| Affiliation: | 1. EV Group US,Inc.,3701E.University Drive,Suite 300 Phoenix, AZ85034,USA
2. EVGroup,St. Florian,A-4780 Schaerding,Austria |
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| Abstract: | Precision aligned wafer bonding is a key enabling technology for 3D Interconnects, wafer level packages (WLP) and advanced MEMS devices. Unlike MEMS, which frequently involve double side processing, IC and CMOS manufacturing situated in the bond interface i.e. face to face. This paper will report on the principal steps of the face to face alignment method, and on the latest results reporting one micron or better alignment accuracy that are routinely obtained with a specially developed alignment system that uses this method. The principal equipment designs for wafer to wafer alignment and bonding, as well as their modularity for full integration into high volume production lines will be discussed. |
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| Keywords: | 3D Interconnect Alignment Bonding MEMS Packaging Stacking |
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