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Texture and stress analysis of 120 nm copper interconnects
Authors:KJ Ganesh  S Rajasekhara  JP Zhou  PJ Ferreira
Affiliation:1. Electrotechnics and Measurements Department, Technical University of Cluj-Napoca, Baritiu 26-28, Cluj-Napoca, Romania;2. Infineon Technologies Romania & Co. SCS, Dimitrie Pompeiu 6, Sector 2, Bucure?ti, Romania;3. Basis of Electronics Department, Technical University of Cluj-Napoca, Baritiu 26–28, Cluj-Napoca, Romania;1. Graduate School of Science and Engineering, Ibaraki University, Hitachi, Ibaraki 316-8511, Japan;2. Department of Materials Science and Engineering, Ibaraki University, Hitachi, Ibaraki 316-8511, Japan;3. Department of Materials Processing, Graduate School of Engineering, Tohoku University, 6-6-02 Aramaki-aza-Aoba, Sendai 980-8579, Japan;1. Department of Materials Science and Engineering, Texas A&M University, College Station, TX 77843-3123, USA;2. MPA-CINT, Los Alamos National Laboratory, Los Alamos, NM 87545, USA;3. Department of Electrical and Computer Engineering, Texas A&M University, College Station, TX 77843-3128, USA;4. Nuclear Engineering Division, Argonne National Laboratory, Argonne, IL 60439, USA;5. Mechanical and Materials Engineering, University of Nebraska-Lincoln, Lincoln, NE 68588, USA;6. Department of Mechanical Engineering, Texas A&M University, College Station, TX 77843-3123, USA;7. School of Materials Engineering, Purdue University, West Lafayette, IN 47907, USA
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