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高弹性导电合金Cu-Ni-Sn的研究现状
引用本文:郑史烈,吴年强,曾跃武,李志章,陈丰土.高弹性导电合金Cu-Ni-Sn的研究现状[J].材料科学与工程学报,1997(3).
作者姓名:郑史烈  吴年强  曾跃武  李志章  陈丰土
作者单位:浙江大学,浙江汽车齿轮厂
摘    要:Cu-Ni-Sn合金是调幅分解强化型合金。与铍青铜相比,该合金性能优良、价格便宜,因此是一种很有发展前途的铜基弹性材料。本文综述了Cu-Ni-Sn合金的研究现状,对材料的制备、热处理工艺、合金的强化机理、微观结构、性能、及它们在电子工业中的应用作了介绍。

关 键 词:Cu-Ni-Sn合金  弹性合金  调幅分解

High Elastic Cu Ni Sn Alloy for Electronics Application
Zheng Shili\ Wu Nianqiang\ Zeng Yuewu\ Li Zhizhang Zhejiang University,Hangzhou, Chen Fengtu Zhejiang Vehicle and Gear Factory,Jinhua.High Elastic Cu Ni Sn Alloy for Electronics Application[J].Journal of Materials Science and Engineering,1997(3).
Authors:Zheng Shili\ Wu Nianqiang\ Zeng Yuewu\ Li Zhizhang Zhejiang University  Hangzhou  Chen Fengtu Zhejiang Vehicle and Gear Factory  Jinhua
Affiliation:Zheng Shili\ Wu Nianqiang\ Zeng Yuewu\ Li Zhizhang Zhejiang University,Hangzhou,310027 Chen Fengtu Zhejiang Vehicle and Gear Factory,Jinhua,321021
Abstract:The Cu Ni Sn alloy is an attractive copper based elastic material strengthened by spinodal decomposition.This alloy is cheaper and superior in the properties to beryllium bronze.In this paper,preparation,heat treatment,strengthening mechanism,microstructure,properties of the alloy as well as its application to electronics industry are overviewed.
Keywords:Cu Ni Sn alloy\ elastic alloy\  spinodal decomposition  
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