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SiC颗粒表面修饰及形成机理
引用本文:王振廷,秦立富. SiC颗粒表面修饰及形成机理[J]. 表面技术, 2009, 38(4): 11-12,29
作者姓名:王振廷  秦立富
作者单位:黑龙江科技学院材料科学与工程学院,黑龙江,哈尔滨,150027;黑龙江科技学院材料科学与工程学院,黑龙江,哈尔滨,150027
基金项目:黑龙江省教育厅重点项目 
摘    要:
为了改善SiC/金属基之间的润湿性,采用化学镀技术,对SiC颗粒的表面进行了Ni-P化学修饰,并研究了影响SiC颗粒表面Ni-P化学修饰的因素.采用SEM、EDS和XRD对修饰后的SiC颗粒进行了形貌表征和物相分析,并对其修饰机理进行了分析,确定了SiC颗粒表面修饰的最佳工艺参数.结果表明:酸性和碱性修饰液相比,在相同的条件下,碱性修饰液对SiC颗粒的修饰效果较好,修饰后的SiC复合粒子形状规则,SiC颗粒表面形成连续的表面修饰膜.最终确定的最佳试验工艺参数为:pH=8.5~9.0,t=(50±2)℃.

关 键 词:SiC颗粒  表面修饰  化学镀  形貌表征

SiC Particle Surface Modification and Formation Mechanism
WANG Zhen-ting,QIN Li-fu. SiC Particle Surface Modification and Formation Mechanism[J]. Surface Technology, 2009, 38(4): 11-12,29
Authors:WANG Zhen-ting  QIN Li-fu
Affiliation:WANG Zhen-ting,QIN Li-fu(College of Materials Science , Engineering,Heilongjiang Institute of Science , Technology,Harbin 150027,China)
Abstract:
In order to improve the wettability between SiC and metal substrate,Ni-P chemical modification on the surface of SiC particles was made by electroless plating.And the factors affecting Ni-P chemical modification on the surface of SiC particle were investigated.The modified SiC composite particles were studied by SEM,EDS and XRD,and the morphology characterization of the modified SiC particles was preliminary described,and the formation mechanism of it was analyzed.The best process parameters of SiC particle...
Keywords:SiC particles  Surface modification  Chemical plating  Morphology characterization  
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