密封继电器电触头污染的实验研究

本文首先采用扫描电子显微镜（SEM）和俄歇电子能谱仪（AES）分析研究了一种密封继电器镀金电触头（基体材料为99．5AgMgNi）的污染，结果表明：触头的冲击磨损和滑动磨损可导致基体金属暴露于表面，使之硫化、碳化和氧化，从而引起触头污染。文中还运用扫描电子显微镜和四极质谱仪（QMS），对经湿热试验后失效的另一种密封继电器镀金电触头（基体材料为AU50Ag20cU30）的污染进行了分析研究，发现密封继电器内水汽等的存在是导致失效的主要因素，触头受到了污染。为研究、诊断污染的来源并采取相应的措施提供了依据。

THE EXPERIMENTAL STUDY OF CONTAMINATION ON THE ELECTRICAL CONTACTS OF SEALED RELAYS

In this paper the contamination on the gold plated contacts (substrate 99. 5AgMgNi) of a kind of sealed relay is studied using scanning electron microscope (SEM) and Auger electron spectrometer (AES). It is shown that the impact and sliding wear could lead to the exposure of substrate onto the surface,so the sulphuration, carbonation and oxidation take place, causing the contact contamination. The conta-mination on the gold plated contacts (substrate Au50Ag20Cu30) of another kind of seaIed relay which has lost effect after the test of damping and warming is also studied using scanning electron microscope and quadrupole mass spectrometer (QMS). It is discovered that the existence of water vapour etc. is the main reason for the loss of effect, and the contacts are contaminated. This paper provides scientific basis for the study of contamination sources and adoption of the corresponding measures.