Bonding of densified beech wood using adhesives based on thermally modified soy proteins |
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| Authors: | Doroteja Vnu?ec Jure ?igon Marica Mikuljan Frederick A Kamke Milan ?ernek Andreja Kutnar Andreja Gor?ek |
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| Affiliation: | 1.Faculty of Chemistry and Chemical Engineering,University of Maribor,Maribor,Slovenia;2.Department of Wood Science and Technology, Biotechnical Faculty,University of Ljubljana,Ljubljana,Slovenia;3.BREST-POHI?TVO d.o.o. Cerknica,Cerknica,Slovenia;4.Department of Wood Science and Engineering,Oregon State University,Corvallis,USA;5.Department of Wood Science and Technology, Biotechnical Faculty,University of Ljubljana,Ljubljana,Slovenia;6.Andrej Maru?i? Institute,University of Primorska,Koper,Slovenia;7.Faculty of Mathematics, Natural Sciences and Information Technologies,University of Primorska,Koper,Slovenia;8.Faculty of Chemistry and Chemical Engineering,University of Maribor,Maribor,Slovenia |
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| Abstract: | The bondability/glueability of aged and sanded thermo-hydro-mechanically (THM) densified beech wood (Fagus sylvatica L.) was tested and compared with undensified sanded beech wood as a control. THM and control specimens were bonded with five different soy protein isolate (SPI) based adhesives. Commercial SPI powder was thermally modified in the vacuum chamber at 50 or 100?°C and pH adjusted (to pH 10.0) dispersions in water prepared at 24, 50 or 90?°C. Wettability was determined with measuring the sessile drop contact angles of water. Effective penetrations (EPs) and tensile shear strengths of THM and control specimens were determined. THM and control wood had similar wettability. Although THM wood had lower moisture content than control wood, it absorbed the water more slowly than control wood. THM specimens showed lower EPs than control specimens when comparing individual adhesives due to increased density of THM wood. Adhesives prepared with SPI thermally modified at 50?°C showed statistically significantly lower tensile shear strength of bonded THM specimens than that of bonded control specimens. THM densification had no significant effect on the bonding strengths of adhesives prepared with non-modified SPI and SPI thermally modified at 100?°C. |
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