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The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes |
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| Authors: | R. Durairaj Lam Wai Man N.N. Ekere S. Mallik |
| Affiliation: | 1. Department of Mechanical and Manufacturing Engineering, Faculty of Engineering and Science (FES), Universiti Tunku Abdul Rahman (UTAR), Jalan Genting Kelang, Setapak 53300, Kuala Lumpur, Malaysia;2. Electronic Manufacturing Engineering Research Group, The Medway School of Engineering, University of Greenwich, Pembroke, Chatham Maritime, Kent ME4 4TB, United Kingdom |
| Abstract: | Wall-slip plays an important role in the flow behaviour of solder paste materials. The wall-slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin liquid layer adjacent to the wall, which causes slippage. The aim of this study is to investigate the influence of the solder paste formulation on wall-slip formation and its effect on the printability of these pastes material. A wall-slip model is utilised to calculate the true viscosity and slip velocity for the lead-free solder pastes samples used in this study. The difference in the measured viscosity and the true viscosity could indicate wall-slip formation between the solder pastes and the parallel plate. Sample P1 showed a higher slip velocity compared to sample P2. The slip velocity calculated for the solder pastes could be used as a performance indicator to understand the paste release characteristics in the stencil printing process. |
| Keywords: | Lead-free Solder paste Rheology Viscosity Wall-slip Stencil printing process |
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