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| SiC粒子增强化学复合镀层性能的工艺研究 | |
| 引用本文： | 侯俊英. SiC粒子增强化学复合镀层性能的工艺研究[J]. 中国铸造装备与技术, 2010, 0(5) |
| 作者姓名： | 侯俊英 |
| 作者单位： | 青岛科技大学机电学院,山东青岛市,266061 |
| 摘 要： | 本文主要进行了Ni-P-SiC化学复合镀工艺研究。为了得到一个复合粒子(纳米SiC)添加量合适、沉积速度快、外观光亮、与基体结合牢固等良好性能的化学复合镀层,在参考有关化学复合镀镀液组成研究的基础上,选择了不同的复合粒子添加量和相应的施镀工艺条件进行试验,并对所得到的复合镀层,采用金相显微镜进行了金相组织、外观、厚度等方面的性能测试。着重分析了复合粒子添加量对镀层的影响。 |
| 关 键 词： | 化学复合镀 复合粒子 工艺条件 沉积速度 |
Technology Research of Properties of SiC Strengthened Chemical Compound Plating Coatings |
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| HOU JunYing. Technology Research of Properties of SiC Strengthened Chemical Compound Plating Coatings[J]. China Foundry Machinery & Technology, 2010, 0(5) | |
| Authors: | HOU JunYing |
| Affiliation: | HOU JunYing(Institute of Mechanical Electron Qingdao University of Science and Technology,Qingdao 266061,Shandong China) |
| Abstract: | The technology of Ni-P-SiC chemical compound plating has been researched.In order to obtain a good compound plating with quick deposition rate,luminous outward appearance,good binding to substrate and suitable amount of SiC,with reference to research of fluid composition of related plates,various amount of SiC and corresponding technology conditions have been selected in experiments.The microstructure,appearance and thickness of compound plating obtained have been tested by microscope.The data which obtaine... |
| Keywords: | Chemical compound plating Compound particles Technological parameters Deposition rate |
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