|
|||||
|
|
| 高频印刷电路基板用树脂及其改性研究进展 | |
| 引用本文： | 李冬云,高朋召,葛洪良,金小伟,叶芳,俞能君. 高频印刷电路基板用树脂及其改性研究进展[J]. 工程塑料应用, 2011, 39(10): 103-106 |
| 作者姓名： | 李冬云 高朋召 葛洪良 金小伟 叶芳 俞能君 |
| 作者单位： | 1. 中国计量学院材料科学与工程学院,杭州,310018 2. 湖南大学材料科学与工程学院,长沙,410082 3. 义乌市先通电子材料有限公司,义乌,322006 |
| 摘 要： | 介绍了高频电路对印刷电路基板材料的特性参数(如介电常数、介质损耗因数、特性阻抗和玻璃转变温度等)的要求；综述了应用于高频电路基板的树脂基体及其改性体系的研究现状,指出了它们各自的特点和不足；展望了高频印刷电路基板用树脂及其改性的可能发展方向. |
| 关 键 词： | 高频印刷电路基板 树脂 改性 介电性能 |
PROGRESS IN RESEARCH ON RESIN MATRIX AND ITS MODIFICATION USED IN HIGH FREQUENCY PRINTED CIRCUIT BOARDS |
|
| Li Dongyun,Gao Pengzhao,Ge Hongliang,Jin Xiaowei,Ye Fang,Yu Nengjun. PROGRESS IN RESEARCH ON RESIN MATRIX AND ITS MODIFICATION USED IN HIGH FREQUENCY PRINTED CIRCUIT BOARDS[J]. Engineering Plastics Application, 2011, 39(10): 103-106 | |
| Authors: | Li Dongyun Gao Pengzhao Ge Hongliang Jin Xiaowei Ye Fang Yu Nengjun |
| Affiliation: | (1.College of Materials Science and Engineering,China Jiliang University,Hangzhou 310018,China; 2.College of Materials Science and Engineering,Hunan University,Changsha 410082,China; 3.Yiwu Xiantong Electronic Material Co.Ltd.,Yiwu 322006,China) |
| Abstract: | The requirements of the high-frequency circuit on characteristic parameters of the printed circuit board substrate materials(such as dielectric constant,dielectric loss factor,the characteristic impedance and the glass transition temperature etc) were introduced briefly.The research progress of resin matrix systems and their modified systems used in high frequency printed circuit boards was reviewed,advantages and limitations of these materials were pointed out.The development trend of resin matrixes and their modified systems used in high frequency circuit board were outlooked. |
| Keywords: | high-frequency circuit board resin modification dielectric properties |
| 本文献已被 CNKI 万方数据 等数据库收录！ | |