SMT焊接缺陷研究

当今,作为主要的电子装联技术,表面组装技术得到了长足的发展。表面组装产品由于在成本、质量和可靠性等方面具有相当的优势,使其受到广大用户的青睐。虽然表面组装技术和表面组装产品具有无可比拟的优势,但是表面组装技术涉及的因素众多,包括器件、材料、设备和工艺等,这导致表面组装过程中容易出现焊接缺陷。焊接缺陷严重影响表面组装产品的质量和可靠性,对其应进行深入的研究。本文探讨了在表面贴装过程中的焊接缺陷类型,它们的检测判据,分析了它们产生的主要原因及危害,并提出了相应的预防处理措施。

SMT soldering defects research

Nowadays,as the main electronics assembly technology, the surface mount technology has got great development. Due to the cost, quality and reliability, surface mount products have a considerable advantage, favored by users. Although the surface mount technology and surface mount products have this advantage, the surface mount technology relates to many factors, including devices, materials, equipment and technology, which led to the surface assembly can easily arise welding defects. Welding defects seriously affected surface assembly quality and reliability of products, should be in-depth studied. This paper discusses the surface mount process of welding defect types, their detection criterion, analyzes their causes and harm, and puts forward the corresponding prevention and treatment measures.