| 激光切割CVD金刚石厚膜的工艺研究 |
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| 引用本文： | 熊军,汪建华,王传新,严朝辉,王亚.激光切割CVD金刚石厚膜的工艺研究[J].工具技术,2007,41(4):21-23. |
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| 作者姓名： | 熊军 汪建华 王传新 严朝辉 王亚 |
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| 作者单位： | 1. 武汉工程大学湖北省等离子体化学与新材料重点实验室,430074 武汉市
2. 武汉工程大学 |
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| 基金项目： | 湖北省科技攻关项目
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湖北省高等学校优秀中青年科技创新团队计划 |
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| 摘 要： | 本文利用Nd:YAG激光器对0.4mm厚的CVD金刚石膜进行切割,用扫描电子显微镜(SEM)研究了激光脉冲能量、脉冲宽度和脉冲频率等工艺参数对金刚石厚膜切割的影响。研究结果表明,在脉冲电流高于200A和减小脉冲电流至150A、脉冲宽度为2ms时能一次性切透金刚石厚膜但切割断面存在许多微裂纹和缺陷。增大脉冲频率有利于提高切割断面的平整度;采用二次切割比一次切割可得到更为平整的切割断面,断面粗糙度Ra可达到1μm。
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| 关 键 词： | 激光 切割 CVD金刚石厚膜 |
| 修稿时间： | 2006-08 |
Technical Study of Cutting CVD Diamond Thick Film Using Laser Technology |
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| Xiong Jun, Wang Jianhua ,Wang Chuanxin ,et al.Technical Study of Cutting CVD Diamond Thick Film Using Laser Technology[J].Tool Engineering(The Magazine for Cutting & Measuring Engineering),2007,41(4):21-23. |
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| Authors: | Xiong Jun Wang Jianhua Wang Chuanxin |
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| Affiliation: | Xiong Jun Wang Jianhua Wang Chuanxin et al |
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| Abstract: | Nd:YAG laser machine is used for cutting CVD diamond thick film(0.4mm). The influences of pulse power, pulse length and pulse frequency of the laser on the cutting quality are studied by SEM. The research results show that the diamond thick film can be cut off if the pulse current is higher than 200A but the cut section exist many crack and disfigurement. Reduce pulse current and pulse length to 150A and 2ms is the least condition to cut off the diamond thick film by one time. The cut section will more smooth when increasing the pulse frequency. The cut sections of CVD diamond thick film will more level if laser secondary cutting technology is used and the roughness (Ra) of cut section can be 1μm. |
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| Keywords: | laser cutting CVD diamond thick film |
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