Mechanical property enhancement of non‐bonding electrospun mats via adhesive |
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| Authors: | Woo‐Il Baek Hem Raj Pant R Nirmala Ki‐Taek Nam Hyun‐Ju Oh Hak‐Yong Kim |
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| Affiliation: | 1. Department of Organic Materials and Fiber Engineering, Chonbuk National University, Jeonju 561‐756, Republic of Korea;2. Center for Healthcare Technology and Development, Chonbuk National University, Jeonju 561‐756, Republic of Korea;3. Department of Bio‐nano System Engineering, Chonbuk National University, Jeonju 561‐756, Republic of Korea;4. Department of Engineering Science and Humanities, Pulchowk Campus, Tribhuvan University, Nepal |
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| Abstract: | In the present study, the effect of adhesive on the morphology of different electrospun polymeric mats was investigated. The modification of two polymers, poly(methyl methacrylate) and poly(vinyl chloride), was carried out by blending the polymers with different amounts of poly(butyl acrylate) (PBA) adhesive to investigate the effect of different amounts of adhesive with heat hardener in hybrid mats. The introduction of various concentrations of PBA into different polymer solutions led to the formation of point‐bonded electrospun fibrous mats. Scanning electron microscopy images indicated that point‐bonded polymer/adhesive fibers were uniformly distributed throughout the mats. Fourier transform infrared spectrometry, contact angle measurements and thermogravimetric analysis were used to study the different properties of the hybrid mats. The tensile strength of the blended fibrous electrospun mats was increased effectively. This enhancement of the mechanical properties of the mats due to the presence of adhesive increases the number of potential applications of the electrospun mats, especially for mechanically weak polymers. Copyright © 2012 Society of Chemical Industry |
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| Keywords: | electrospinning hybrid mats adhesive heat hardener point‐bonding |
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