Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages |
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| Affiliation: | 1. College of Mechanical and Electrical Engineering, Hohai University, Changzhou 213022, China;2. Changzhou Institute of Technology Research for Solid State Lighting, Changzhou 213161, China;3. Beijing Research Center, Delft University of Technology, Beijing, China;4. State Key Laboratory of Solid State Lighting, Institute of Semiconductors, Chinese Academy of Sciences, Haidian, Beijing, 100083, China;5. Department of Mechanical Engineering, Lamar University, Beaumont, Texas 77710, USA;6. EEMCS Faculty, Delft University of Technology, Delft, The Netherlands;1. Robert Bosch GmbH, Reliability Modeling and System Optimization (AE/EDT3), Reutlingen 72703, Germany;2. Mechanical Engineering Department, University of Maryland College Park, MD 20742, USA;3. Fraunhofer-Institut für Betriebsfestigkeit und Systemzuverlässigkeit LBF, Darmstadt 64289, Germany;1. Department of Electrical Engineering, National Sun Yat-Sen University, Kaohsiung 804, Taiwan;2. Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan;1. Infineon AG, Am Campeon 1-12, 85579 Neubiberg, Germany;2. Christian Doppler Laboratory for Lifetime and Reliability of Interfaces in Complex Multi-Material Electronics, Institute of Chemical Technologies and Analytics, TU Wien, 1060 Vienna, Austria;3. Institute of Sensor and Actuator Systems, TU Wien, 1040 Vienna, Austria |
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| Abstract: | According to the requirements on minimizing the package size, guaranteeing the performance uniformity and improving the manufacturing efficiency in LEDs, a Chip Scale Packaging (CSP) technology has been developed to produce white LED chips by impressing a thin phosphor film on LED blue chips. In this paper, we prepared two types of phosphor-converted white LED CSPs with high color rendering index (CRI > 80, CCT ~ 3000 K and 5000 K) by using two mixed multicolor phosphor materials. Then, a series of testing and simulations were conducted to characterize both short- and long-term performance of prepared samples. A thermal analysis through both IR thermometry and electrical measurements and thermal simulation were conducted first to evaluate chip-on-board heat dissipation performance. Next, the luminescence mechanism of multicolor phosphor mixtures was studied with the spectral power distribution (SPD) simulation and near-field optical measurement. Finally, the extracted features of SPDs and electrical current-output power (I-P) curves measured before and after a long-term high temperature accelerated aging test were applied to analyze the degradation mechanisms. The results of this study show that: 1) The thermal management for prepared CSP samples provides a safe usage condition for packaging materials at ambient temperature; 2) The Mie theory with Monte-Carlo ray-tracing simulation can be used to simulate the SPD of Pc-white LEDs with mixed multicolor phosphors; 3) The degradation mechanisms of Pc-white LEDs can be determined by analyzing the extracted features of SPDs collected after aging. |
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