Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles |
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| Affiliation: | 1. Physics Department, Faculty of Science, Zagazig University, Zagazig, Egypt;2. Basic Sciences, College of Engineering, University of Business and Technology (UBT), Jeddah, Saudi Arabia;1. Airbus Group Innovations, Suresnes, France;2. Université de Lyon, Ampère, CNRS UMR 5005, INSA Lyon, Villeurbanne, France;3. Université de Technologie de Troyes, Institut Charles Delaunay, CNRS UMR 6279 STMR, Troyes, France;1. Department of Engineering Mechanics, School of Aerospace Engineering, Tsinghua University, Beijing 100084, PR China;2. China Longyuan Power Group Corporation Limited, China Goudian, Beijing 100034, PR China;3. Guangzhou CABR&SC Co.Ltd Architectural Design and Research Institute of Guangdong Province, Guangzhou 510010, PR China;1. Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory, Guangzhou 510610, China;2. State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China;1. National Key Laboratory of Micro/Nano Fabrication Technology, Shanghai Jiao Tong University, Shanghai 200240, China;2. Test&Package (TP) Center, Samsung Electronics Co., Ltd., Asan-City 31489, Republic of Korea;1. School of Aeronautics and Astronautics, Sichuan University, No.24 South Section 1, Yihuan Road, Chengdu 610065, China;2. School of Electrical Engineering and Automation, Harbin Institute of Technology (HIT), #3033, Science Park of HIT, No.2, Yikuang Street, NanGang District, Harbin 150080, China |
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| Abstract: | Sn-Ag-Cu lead-free solders are regarded as a potential substitute for Pb-Sn solder alloys. In the current study, the non-reacting, non-coarsening ZnO nano-particles (ZnO NPs) were successfully incorporated into Sn–3.0Ag–0.5Cu (SAC305) lead-free solder by mechanical mixing of ZnO powders and melting at 900 °C for 2 h. Tensile creep testing was performed for plain SAC305 solder and SAC305-0.7 wt% ZnO NPs composite solders and a Garofalo hyperbolic sine power-law relationship was created from the experimental data to predict the creep mechanism as a function of tensile stress and temperature. Based on the tensile creep results, the creep resistance of SAC305 solder alloy was improved considerably with ZnO NPs addition, although the creep lifetime was increased. From microstructure observation, reinforcing ZnO NPs into SAC305 solder substantially suppressed the enlargement of Ag3Sn and Cu6Sn5 intermetallic compound (IMC) particles and decreased the spacing of the inter-particles between them, reduced the grain size of β-Sn and increased the eutectic area in the alloy matrix. The modification of microstructure, which leaded to a strong adsorption effect and high surface-free energy of ZnO NPs, could result in hindering the dislocation slipping, and thus provides standard dispersion strengthening mechanism. Moreover, the average activation energy (Q) for SAC305 and SAC305-0.7ZnO alloys were 50.5 and 53.1 kJ/mol, respectively, close to that of pipe diffusion mechanism in matrix Sn. |
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